Molded package and semiconductor device using molded package

Details Molded package and semiconductor device using molded package Molded package and semiconductor device using molded package

2006-05-16

2006-05-16

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S099000, C257S100000, C257S433000

Reexamination Certificate

active

07045905

ABSTRACT:
A molded package comprises at least a first metal member, a second metal member, and a third metal member. Each member includes an end portion inserted into a mold member where a recess is formed and another end portion protruding from an outer wall of the mold member. A portion of each main surface of the metal members is exposed from the mold member in the bottom of the recess. A portion of each main surface can be also divided into at least two bonding regions by a wall portion comprising part of the mold member. A semiconductor device of the present invention comprises the molded package, a semiconductor component, and an encapsulating member covering the semiconductor component, and has a high reliability.

REFERENCES:
patent: 3509430 (1970-04-01), Mroz
patent: 3566208 (1971-02-01), Wang
patent: 5309460 (1994-05-01), Fujimaki et al.
patent: 5367530 (1994-11-01), Noishiki et al.
patent: 5859387 (1999-01-01), Gagnon
patent: 2000-188425 (2000-07-01), None

Affiliated with

Also associated with

Rating

Molded package and semiconductor device using molded package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded package and semiconductor device using molded package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded package and semiconductor device using molded package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3635583