Mold and method for manufacturing a package for a semiconductor

Details Mold and method for manufacturing a package for a semiconductor Mold and method for manufacturing a package for a semiconductor

1996-04-03

1997-07-01

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257680, 257710, H01L 2328

Patent

active

056441690

ABSTRACT:
A mold and a method for manufacturing a semiconductor package and the semiconductor package manufactured thereby.
The semiconductor package includes a chip attached to a paddle of a lead frame. And with electrically connecting the chip and inner leads of lead frame with a metal wire, a semi-finished product having electric connections is molded by using molding dies having an extrusion in a cavity for providing an opening on an upper portion of a light receiving region of the chip, and a transparent lid is provided on the upper portion of the opening of the semiconductor package.
With the invention being able to provide an excellent resin semiconductor package and improved manufacturing processes, thereby reducing the manufacturing cost, enhancing a productivity and making a manufacturing process simpler.

REFERENCES:
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 4760440 (1988-07-01), Bigler et al.
patent: 4769344 (1988-09-01), Sakai et al.
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 5122861 (1992-06-01), Tamura et al.

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