LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Package stress management

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Package structure and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Package structure for semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Package structure with a retarding structure and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Package with solder-filled via holes in molding layers

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Package-on-package system with through vias and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaged die on PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packaged die PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packaged integrated circuit with enhanced thermal dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packaged integrated circuit with enhanced thermal dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packaged microelectronic devices and methods for packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Packaged semiconductor device incorporating heat sink plate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packaged semiconductor substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Packages for semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaging integrated circuits for high stress environments

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Packaging material for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaging structure of SIP and a manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Partial underfill for flip-chip electronic packages