Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1992-09-17
1994-11-22
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257690, 257675, 257706, 257708, 257709, 257729, H01L 2328, H01L 2302, H01L 2348, H01L 2944
Patent
active
053671961
ABSTRACT:
There is provided a molded plastic electronic package having improved thermal dissipation. A heat spreader, formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin. Forming a black anodization layer on the surface of the heat spreader improves both thermal dissipation and adhesion to the molding resin.
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Metals Handbook.RTM., 9th Edition, vol. 5 at pp. 600-607, 1982.
Braden Jeffrey S.
Chen Szuchain F.
Mahulikar Deepak
Arroyo Teresa M.
Jackson Jerome
Olin Corporation
Rosenblatt Gregory S.
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