Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2005-06-30
2008-09-30
Feely, Michael J (Department: 1796)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S789000, C264S272110, C428S413000, C523S466000, C525S523000, C525S534000
Reexamination Certificate
active
07429800
ABSTRACT:
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
REFERENCES:
patent: 3375228 (1968-03-01), Holoch
patent: 3496236 (1970-02-01), Glenn et al.
patent: 3763088 (1973-10-01), Izawa et al.
patent: 3923738 (1975-12-01), Van Sorge
patent: 4140675 (1979-02-01), White
patent: 4165422 (1979-08-01), White
patent: 4234706 (1980-11-01), White
patent: 4521584 (1985-06-01), Heitz et al.
patent: 4562243 (1985-12-01), Percec
patent: 4593052 (1986-06-01), Irving
patent: 4623558 (1986-11-01), Lin
patent: 4634742 (1987-01-01), Percec
patent: 4663402 (1987-05-01), Percec et al.
patent: 4665137 (1987-05-01), Percec
patent: 4677185 (1987-06-01), Heitz et al.
patent: 4701514 (1987-10-01), Percec
patent: H521 (1988-09-01), Fan
patent: 4806601 (1989-02-01), Percec
patent: 4912172 (1990-03-01), Hallgren et al.
patent: 4920164 (1990-04-01), Sasaki et al.
patent: 4923932 (1990-05-01), Katayose
patent: 5001010 (1991-03-01), Chao et al.
patent: 5015675 (1991-05-01), Walles et al.
patent: 5021543 (1991-06-01), Mayska et al.
patent: 5064882 (1991-11-01), Walles et al.
patent: 5071922 (1991-12-01), Nelissen
patent: 5079268 (1992-01-01), Nelissen
patent: 5080221 (1992-01-01), Steinkotter
patent: 5091480 (1992-02-01), Percec
patent: 5162433 (1992-11-01), Nishio et al.
patent: 5213886 (1993-05-01), Chao et al.
patent: 5290883 (1994-03-01), Hosokawa et al.
patent: 5314984 (1994-05-01), Markovitz et al.
patent: 5618891 (1997-04-01), Markovitz
patent: 5834565 (1998-11-01), Tracy et al.
patent: 5872201 (1999-02-01), Cheung et al.
patent: 5965663 (1999-10-01), Hayase
patent: 6051662 (2000-04-01), Tracy et al.
patent: 6054222 (2000-04-01), Takami et al.
patent: 6096821 (2000-08-01), Adedeji et al.
patent: 6197898 (2001-03-01), van den Berg et al.
patent: 6307010 (2001-10-01), Braat et al.
patent: 6319969 (2001-11-01), Walther et al.
patent: 6333064 (2001-12-01), Gan
patent: 6352782 (2002-03-01), Yeager et al.
patent: 6384176 (2002-05-01), Braat et al.
patent: 6387990 (2002-05-01), Yeager
patent: 6404068 (2002-06-01), Tanaka et al.
patent: 6469124 (2002-10-01), Braat et al.
patent: 6518362 (2003-02-01), Clough et al.
patent: 6524702 (2003-02-01), Betso et al.
patent: 6569982 (2003-05-01), Hwang et al.
patent: 6576700 (2003-06-01), Patel
patent: 6576718 (2003-06-01), Yeager et al.
patent: 6617398 (2003-09-01), Yeager et al.
patent: 6617400 (2003-09-01), Yeager et al.
patent: 6627704 (2003-09-01), Yeager et al.
patent: 6627708 (2003-09-01), Braat et al.
patent: 6632892 (2003-10-01), Rubinsztajn et al.
patent: 6689920 (2004-02-01), Ishii et al.
patent: 6774160 (2004-08-01), Yeager
patent: 6777460 (2004-08-01), Plazzotto et al.
patent: 6784260 (2004-08-01), Yeager et al.
patent: 6787633 (2004-09-01), Peemans et al.
patent: 6794481 (2004-09-01), Amagai et al.
patent: 6800373 (2004-10-01), Gorczyca
patent: 6812276 (2004-11-01), Yeager
patent: 6835785 (2004-12-01), Ishii
patent: 6878783 (2005-04-01), Yeager et al.
patent: 6897282 (2005-05-01), Freshour et al.
patent: 7067595 (2006-06-01), Zarnoch et al.
patent: 7148296 (2006-12-01), Zarnoch et al.
patent: 7235192 (2007-06-01), Yeager et al.
patent: 7378455 (2008-05-01), Lu et al.
patent: 2002/0068530 (2002-06-01), Li
patent: 2002/0077447 (2002-06-01), Hwang et al.
patent: 2003/0018131 (2003-01-01), Davis et al.
patent: 2003/0130438 (2003-07-01), Amagai et al.
patent: 2003/0212230 (2003-11-01), Rubinsztajn et al.
patent: 2003/0215588 (2003-11-01), Yeager et al.
patent: 2004/0054121 (2004-03-01), Peemans et al.
patent: 2004/0146692 (2004-07-01), Inoue et al.
patent: 2004/0147715 (2004-07-01), Ishii et al.
patent: 2004/0152848 (2004-08-01), Ishii et al.
patent: 2004/0166241 (2004-08-01), Gallo et al.
patent: 2004/0214004 (2004-10-01), Amagai et al.
patent: 2004/0258852 (2004-12-01), Ohno et al.
patent: 2004/0265595 (2004-12-01), Tokiwa
patent: 2005/0065241 (2005-03-01), Ishii et al.
patent: 2005/0070685 (2005-03-01), Mitsui et al.
patent: 2005/0075642 (2005-04-01), Felt et al.
patent: 2005/0181214 (2005-08-01), Campbell et al.
patent: 2006/0135705 (2006-06-01), Vallance et al.
patent: 2006/0160982 (2006-07-01), Ishii et al.
patent: 2007/0004819 (2007-01-01), Lu et al.
patent: 2007/0004871 (2007-01-01), Lu et al.
patent: 0 137 545 (1987-07-01), None
patent: 261574 (1991-11-01), None
patent: 0537005 (1993-04-01), None
patent: 1630199 (2006-03-01), None
patent: 10-182940 (1998-07-01), None
patent: WO 03/072628 (2003-09-01), None
Machine Translation of JP 10-182940, provided by the JPO website (1998).
JP1994271837A; Sep. 27, 1994; Machine Translation (12 pages).
JP2002187937A; Jul. 5, 2002; Machine Translation (25 pages).
International Search Report; International Application No. PCT/US2006/023957; International Filing Date Jun. 20, 2006; Date of Mailing Dec. 12, 2006 (6 pages).
Venderbosch et al., “Processing of intractable polymers using reactive solvents: 2. Poly(2,6-dimethyl-1,4-phenylene ether) as a matrix material for high performance composites”, Polymer, vol. 36, No. 6, pp. 1167-1178, 1995.
JP1997202850A; Aug. 5, 1997; “Epoxy Resin Composition for Sealing Use, Semiconductor Device Using the Same, and Production of the Composition”; Machine Translation (21 pages).
JP1997202851A; Aug. 5, 1997; “Epoxy Resin Composition for Sealing Use, Semiconductor Device Using the Same, and Production of the Composition”; Machine Translation (23 pages).
JP1998265553A; Oct. 6, 1998; “Epoxy Resin Composition for Sealing Material and Semiconductor Device”; Machine Translation (21 pages).
JP2003313290A; Nov. 6, 2003; “Process for Depositing Low-Molecular Weight Polyphenylene Ether”; Machine Translation (12 pages).
JP2003313291A; Nov. 6, 2003; “Process for Producing Expoxidized Polyphenylene Ether”; Machine Translation (17 pages).
JP2004115619A; Apr. 15, 2004; “Method for Producing Bifunctional Phenylene Ether”; Machine Translation (17 pages).
JP3525745B2; May 10, 2004; “Epoxy Resin Composition and Electric Insulating Substrate Made from the Same”; Machine Translation (15 pages).
JP3570146B2; Sep. 29, 2004; “Epoxy Resin Compositions and Adhesive Sheets and Heat-Resistant Laminates Therefrom”; Machine Translation (17 pages).
JP3570148B2; Sep. 29, 2004; “Epoxy Resin Compositions and Their Uses in Prepregs and Laminates”; Machine Translation (21 pages).
JP2004256717A; Sep. 16, 2004; “Oligomer-Modified Epoxy Resin, Its Composition, and Printed Wiring Board Using the Composition”; Machine Translation (38 pages).
JP2004307554A; Nov. 4, 2004; “Continuous Manufacture of Low-Molecular Weight Poly(Phenylene Ethers)”; Machine Translation (31 pages).
JP2004315725A; Nov. 11, 2004; “Fireproofing Polyphenylene Ether Resin Composition and Prepreg, Metallic Laminate, and Printed Circuit Board Prepared Thereby”; Machine Translation (15 pages).
JP2004331958A; Nov. 25, 2004; “Cured Products of Epoxy Resin Compositions Containing Epoxidized Poly(Phenylene Ethers) for Electronic Materials”; Machine Translation (22 pages).
JP2005023201A; Jan. 27, 2005; “Production Method of Bifunctional Phenylene Ether Oligomer”; Machine Translation (27 pages).
WO2004104097; Dec. 2, 2004; Abstract Only (1 page).
James V. Crivello, “The Synthesis and Cationic Polymerization of Novel Epoxide Monomers”, Polymer Engineering and Science (1992), vol. 32, No. 20, pp. 1462-1465.
Prolongo, Silvia G., et al., “Poly(phenylene Ether)/Epoxy Thermoset Blends Based on Anionic Polymerization of Epoxy Monomer”; Journal of Applied Polymer Science; vol. 93, 2678-2687 (2004).
Semi G 69 0996; “Test Method for
Lu Qiwei
O'Brien Michael
Rocha-Galicia Gerardo
Susarla Prameela
Cantor & Colburn LLP
Feely Michael J
Sabic Innovative Plastics IP B.V.
LandOfFree
Molding composition and method, and molded article does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molding composition and method, and molded article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding composition and method, and molded article will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3987325