Module component

Details Module component Module component

2007-01-09

2007-01-09

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S100000, C257S788000, C257S789000, C257S790000, C257SE23125, C257SE23126

Reexamination Certificate

active

10485540

ABSTRACT:
A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

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