Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2007-03-13
2007-03-13
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
Reexamination Certificate
active
11186714
ABSTRACT:
A mold gate of a tape substrate includes an aperture formed in the flexible dielectric film of the tape substrate and a support element which is carried by a surface of the flexible dielectric film. The aperture of the mold gate may be formed by die cutting or etching processes. The support element of the mold gate is substantially coplanar with conductive traces carried by the flexible dielectric film, and may be formed from the same material as the conductive traces. The support element of the mold gate may be fabricated by patterning a conductive film and formed at substantially the same time as the conductive traces of the tape substrate are formed. Packaging methods and degating methods that include use of the tape substrate are also disclosed.
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Lee Teck Kheng
Vijendran M
Andujar Leonardo
Micro)n Technology, Inc.
Soderholm Krista
TraskBritt
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