4. Semiconductor device manufacturing: process
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Backside coating for MEMS wafer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Backside contact for integrated circuit and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Backside device deprocessing of a flip-chip multi-layer...

Semiconductor device manufacturing: process – With measuring or testing
Utility Patent

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Backside encapsulation of tape automated bonding device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Backside etch process chamber and method

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent

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Backside failure analysis capable integrated circuit packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Backside failure analysis for BGA package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Backside failure analysis of integrated circuits

Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate

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Backside IC device preparation process

Semiconductor device manufacturing: process – With measuring or testing
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Backside illuminated image sensor with reduced dark current

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Backside illuminated image sensor with shallow backside...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Backside illuminated imaging sensor with light reflecting...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate

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Backside illumination of CMOS image sensor

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Backside integrated circuit die surface finishing technique...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Backside metallization on sides of microelectronic dice for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Backside method for fabricating semiconductor components...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Backside method for fabricating semiconductor components...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Backside processing method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent

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