Backside processing method

Details Backside processing method Backside processing method

1992-02-03

1999-07-27

Bowers, Charles

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

438458, 438459, 438464, H01L 21301

Patent

active

059279931

ABSTRACT:
A method useful in the backside processing of semiconductor wafers includes providing a semiconductor wafer having a first surface that has been substantially processed. The processed first surface of the semiconductor wafer is bonded to a handle wafer. Once bonded to the handle wafer, backside processing may be performed on the wafer. Following backside processing, the wafer is sawn while still bonded to the handle wafer. The individual dice are then removed from the handle wafer. This process involves fewer handling steps of the semiconductor wafer and the handle wafer provides support to the semiconductor wafer during backside processing thereby reducing opportunities for breakage.

REFERENCES:
patent: 4946716 (1990-08-01), Corrie
patent: 5165283 (1992-11-01), Kurtz et al.

Affiliated with

Also associated with

Rating

Backside processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Backside processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Backside processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-871487