Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-06-20
2006-06-20
Pham, Hoai (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S458000, C438S460000
Reexamination Certificate
active
07064014
ABSTRACT:
A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
REFERENCES:
patent: 6008537 (1999-12-01), Kosaki et al.
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Chandran Biju
Dias Rajen
Intel Corporation
Pham Hoai
Rao Shrinivas H.
Winkle Robert G.
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