Backside metallization on sides of microelectronic dice for...

Details Backside metallization on sides of microelectronic dice for... Backside metallization on sides of microelectronic dice for...

2006-06-20

2006-06-20

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S458000, C438S460000

Reexamination Certificate

active

07064014

ABSTRACT:
A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.

REFERENCES:
patent: 6008537 (1999-12-01), Kosaki et al.
patent: 1 085 570 (2001-03-01), None
patent: 57 181133 (1982-11-01), None
patent: 58 033882 (1983-02-01), None
patent: 06 013654 (1994-01-01), None
patent: 06 169015 (1994-06-01), None

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