Backside failure analysis of integrated circuits

Details Backside failure analysis of integrated circuits Backside failure analysis of integrated circuits

2006-06-20

2006-06-20

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

C438S014000, C438S015000, C438S124000, C438S690000

Reexamination Certificate

active

07063987

ABSTRACT:
Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises removing a portion of the backside package of the DUT to allow for the implementation of an image based diagnostic test through the backside of the DUT. The functionality of DUT is destroyed by the removal of the portion of the backside package of the DUT. Further, restoring the functionality of the DUT with an interface carrier before an image based diagnostic test is conducted.

REFERENCES:
patent: 6159838 (2000-12-01), Tsai et al.

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