Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1996-03-12
1998-11-10
Nielbing, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438119, 438123, 438124, H01L 2144, H01L 2148, H01L 2150
Patent
active
058343369
ABSTRACT:
A TAB device (10) is coupled to a circuit board (12). The TAB device (10) includes a semiconductor die (11) having leads (18) extending therefrom. A material layer (30), typically a polyimide layer, covers the inward portion of the leads (18) to maintain leading position during attachment of the TAB device (10) to the circuit board (12). Prior to attachment, a backside encapsulation region (40) is applied to the backside of the TAB device (10), sealing the backside of the leads (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (30), to prevent excessive warpage. During attachment, migration of the die attach layer (22) towards the leads will be stopped by the backside encapsulation region (40), preventing the die attach material from shorting the leads (18) of the device (10).
REFERENCES:
patent: 5073521 (1991-12-01), Braden
patent: 5350811 (1994-09-01), Ichimura et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5471027 (1995-11-01), Call et al.
Maheshwari Abhay
Thomas Sunil
Donaldson Richard L.
Kesterson James C.
Neerings Ronald O.
Nielbing John
Texas Instruments Incorporated
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