Backside metallization on microelectronic dice having...

Details Backside metallization on microelectronic dice having... Backside metallization on microelectronic dice having...

2005-10-18

2005-10-18

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S122000

Reexamination Certificate

active

06955947

ABSTRACT:
A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a beveled sidewall and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the beveled sidewall.

REFERENCES:
patent: 5693981 (1997-12-01), Schneider et al.
patent: 5936304 (1999-08-01), Lii et al.
patent: 6455920 (2002-09-01), Fukasawa et al.

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