LandOfFree - US Patents - Listing for Semiconductor device manufacturing: process

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Use of multiple etching steps to reduce lateral etch undercut

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating

Use of nanoscale particles for creating scratch-resistant...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of nitrides for flip-chip encapsulation

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of nitrides for flip-chip encapsulation

Semiconductor device manufacturing: process – Repair or restoration

Use of optimized film stacks for increasing absorption for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of organic spin on materials as a stop-layer for local...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Use of oxalyl chloride to form chloride-doped silicon dioxide fi

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of palladium in IC manufacturing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Use of palladium in IC manufacturing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Use of palladium in IC manufacturing with conductive polymer...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Use of palladium in IC manufacturing with conductive polymer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of PE-SiON or PE-Oxide for contact or via photo and for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of PE-SiON or PE-OXIDE for contact or via photo and for...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Use of phoslon (PNO) for borderless contact fabrication,...

Semiconductor device manufacturing: process – Chemical etching

Use of photoresist focus exposure matrix array as via etch...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Use of photoresist in substrate vias during backside grind

Semiconductor device manufacturing: process – Making field effect device having pair of active regions...

Use of poly resistor implant to dope poly gates

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Use of polybenzoxazoles (PBOS) for adhesion

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Use of polymer spacers for the fabrication of shallow trench iso