Use of polybenzoxazoles (PBOS) for adhesion

Details Use of polybenzoxazoles (PBOS) for adhesion Use of polybenzoxazoles (PBOS) for adhesion

2006-05-30

2006-05-30

Guerrero, Maria F. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S628000, C438S644000, C438S654000, C438S623000, C438S780000

Reexamination Certificate

active

07052936

ABSTRACT:
The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).

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