Use of palladium in IC manufacturing with conductive polymer...

Details Use of palladium in IC manufacturing with conductive polymer... Use of palladium in IC manufacturing with conductive polymer...

2005-09-06

2005-09-06

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S118000, C438S597000, C438S610000, C438S612000, C438S613000, C438S644000

Reexamination Certificate

active

06939744

ABSTRACT:
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point, are provided. The present invention also relates to assemblies comprising one or more of these substrates.

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