Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-09-26
2009-10-06
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257S789000, C257S795000, C257SE21502
Reexamination Certificate
active
07598126
ABSTRACT:
Inorganic-based nanoparticles, such as nanoparticles based on silicon dioxide, are used in order to produce protective layers for semiconductor chips having scratch-resistant properties. The nanoparticles are preferably processed to form a sol, which is applied onto the semiconductor chips to be coated and subsequently converted by sintering into the protective layer.
REFERENCES:
patent: 4254426 (1981-03-01), Pankove
patent: 6365269 (2002-04-01), Atzesdorfer et al.
patent: 6469086 (2002-10-01), Neu et al.
patent: 2003/0047111 (2003-03-01), Niume et al.
patent: 2003/0161959 (2003-08-01), Kodas et al.
patent: 10059487 (2002-06-01), None
patent: 10153176 (2003-03-01), None
patent: 03178123 (1991-08-01), None
patent: 0106754 (2001-09-01), None
patent: 0232588 (2002-04-01), None
H.-Q. Nguyen et al., “Thermische Aufbringung neuartiger Korrosionsschichten für Leichtmetalle auf der Basis oxidischer Nanopartikel,” Karl-Winnacker-Institu der Dechema e.V., Franfurt am Main, Jan. 2004, with English translation of citation.
Chambliss Alonzo
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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