Misalignment tolerant techniques for dual damascene fabrication
Mixed-scale electronic interfaces
MOCVD apparatus and method
MOCVD metal oxide for one transistor memory
MOCVD molybdenum nitride diffusion barrier for Cu metallization
MOCVD of tungsten nitride thin films using W(CO) 6 and NH 3...
MOCVD process using ozone as a reactant to deposit a metal...
Modified buried contact process for IC device fabrication
Modified clean recipe to suppress formation of BPSG bubble
Modified dual damascene process
Modified implementation of air-gap low-K dielectric for unlanded
Modified tungsten-plug contact process
Modified via bottom structure for reliability enhancement
Modular substrate processing system
Modulating surface morphology of barrier layers
Moisture barrier gap fill structure and method for making the sa
Moisture corrosion inhibitor layer for Al-alloy...
Molded dielectric layer in print-patterned electronic circuits
MOS transistor and fabrication thereof
MOS transistor gates with thin lower metal silicide and...