Adherent all-gold electrode structure for lithium niobate...

Details Adherent all-gold electrode structure for lithium niobate... Adherent all-gold electrode structure for lithium niobate...

2005-03-15

2005-03-15

Tokar, Michael (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

06867134

ABSTRACT:
An electrode structure wherein galvanic corrosion at adhesion layers formed between electrodes and electronic or electro-optic substrates is eliminated. The electrode structure includes an electro-optic crystalline substrate, an amorphous layer disposed on the crystalline substrate, the amorphous layer having a composition substantially similar to a composition of the crystalline substrate, and a gold layer disposed directly on the amorphous layer. The amorphous layer is created using ion sputtering etching techniques that clean and activate the surface of the crystalline substrate such that the gold layer is able to adhere to it.

REFERENCES:
patent: 4750979 (1988-06-01), Gee et al.
patent: 6187665 (2001-02-01), Chetlur et al.
patent: 6522793 (2003-02-01), Szilagyi et al.
Robert F.Pierret, Field Effect Devices, 1983, Addison-Wesley Publishing Company , Inc, vol. IV, cover and pp. 63 and 82.*
U.S. patent application Ser. No. 10/261,877, Chen, filed Oct. 1, 2002.

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