Borderless vias with HSQ gap filled metal patterns having...

Boron phosphide-based semiconductor layer and vapor phase...

Borophosphosilicate glass incorporated with fluorine for low the

BPSG planarization method having improved planarity and reduced

C x H y sacrificial layer for cu/low-k interconnects

C x H y sacrificial layer for cu/low-k interconnects

Capacitor with hafnium, lanthanum and oxygen mixed...

Capacitors and methods with praseodymium oxide insulators

Carbon and halogen doped silicate glass dielectric layer and...

Carbon doped oxide deposition

Carbon nanotube device and process for manufacturing same

Carbon nanotube device, method of manufacturing the same,...

Carbon nanotube growth

Catalytic deposition method for a semiconductor surface...

Charged particle deposition of electrically insulating films

Chemical mechanical electropolishing system

Chemical treatment of semiconductor substrates

Chemical treatment of semiconductor substrates

Chemical treatment of semiconductor substrates

Chemical vapor deposition of high quality flow-like silicon...