Contacts for a bit line and a storage node in a...

Control methodology using optical emission spectroscopy...

Control of etch profiles during extended overetch

Control of patterned etching in semiconductor features

Controlled etching of oxides via gas phase reactions

Controlled linewidth reduction during gate pattern formation usi

Copper etch using HCI and HBr chemistry

Copper etch using HCl and HBR chemistry

Corrosion-resistant system and method for a plasma etching...

Counterbore dielectric plasma etch process particularly...

Crack stop trenches in multi-layered low-k semiconductor...

Critical dimension control for integrated circuits

Critical dimension controlled method of plasma descum for...

Crystallographic wet chemical etching of III-nitride material

CVD TiSiN barrier for copper integration

CVD TiSiN barrier for copper integration