Control of etch profiles during extended overetch

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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Details

438733, 438719, 156346C, 20419237, 20429831, H01L 2100

Patent

active

057599220

ABSTRACT:
An etch process to substantially eliminate notching in sub-micron features by exposing a wafer to a chlorine plasma; operating the plasma under conditions which reduce the relative role of ions in the etch (as compared to neutrals in the etch); and essentially eliminating the magnetic field confinement in the transition zone of the etcher, i.e., the zone between the high density source and the wafer.

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