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Sacrificial feature for corrosion prevention during CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Scratch reduction for chemical mechanical polishing

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Segmented box-in-box for improving back end overlay measurement

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Selective polish for fabricating electronic devices

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Selective removal of tantalum-containing barrier layer...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Selective slurries for the formation of conductive structures

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-aligned contact formation for semiconductor devices

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-aligned contact formation for semiconductor devices

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-aligned interconnect using high selectivity metal pillars a

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-aligned via process for preventing poison via formation

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-passivation procedure for a copper damascene structure

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Self-planarized gap-filling by HDPCVD for shallow trench...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor chip reclamation technique involving multiple plan

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor configuration and corresponding production...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device and fabrication process therefor

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device and manufacturing method therefor

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device and method of manufacture thereof

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device fabricating method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Semiconductor device fabrication method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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