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L-shaped spacer incorporating or patterned using amorphous...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Lapping carrier, apparatus for lapping a wafer and method of...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Laser ablation to selectively thin wafers/die to lower...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Layer independent alignment system

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Light sensitive chemical-mechanical polishing method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Linear CMP tool design using in-situ slurry distribution and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Linear CMP tool design with closed loop slurry distribution

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Lining and corner rounding method for shallow trench isolation

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Low cost and low dishing slurry for polysilicon CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Low friction polish-stop stratum for endpointing chemical-mechan

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Low stress barrier layer removal

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Low stress barrier layer removal

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Low temperature chemical mechanical polishing of dielectric mate

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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LSI device polishing composition and method for producing...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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