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Hardening of copper to improve copper CMP performance

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Headless CMP process for oxide planarization

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High aspect ratio gapfill process by using HDP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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High density contacts having rectangular cross-section for...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High PH slurry for chemical mechanical polishing of copper

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High removal rate chemical-mechanical polishing

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High through-put Cu CMP with significantly reduced erosion...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High-speed planarizing apparatus and method for chemical mechani

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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High-speed planarizing apparatus for chemical-mechanical...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Highly selective and complete interconnect metal line and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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