Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2005-01-06
2008-11-04
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S693000, C438S756000, C051S307000
Reexamination Certificate
active
07446046
ABSTRACT:
A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.
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Mahajan Uday
Zhang Liming
Intel Corporation
Jr. Carl Whitehead
Rodgers Colleen E
Schwabe Williamson & Wyatt P.C.
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