Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2007-03-20
2007-03-20
Parker, Kenneth (Department: 2815)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S108000, C438S112000, C257SE23135, C257S706000, C257S710000, C257S729000
Reexamination Certificate
active
11122052
ABSTRACT:
A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.
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Kasuya Yasumasa
Oka Junji
Shibata Kazutaka
Chu Chris C.
Parker Kenneth
Rabin & Berdo P.C.
Rohm & Co., Ltd.
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