Adhesive bonding sheet, semiconductor device using the same,...

Aluminum metallization for SiGe devices

Amorphous, hydrogenated carbon electroactive passivation layer

Boron phosphorus silicate glass composite layer on semiconductor

Buried oxide with a thermal expansion matching layer for SOI

Cantilevered microtip manufacturing by ion implantation and etch

Dielectric thin film and method of manufacturing same

Dielectrically isolated semiconductor substrate

Dual-masked field isolation

Etch control seal for dissolved wafer micromachining process

Etch control seal for dissolved wafer process

Gallium arsenide devices having reduced surface recombination ve

High quality oxide films on substrates

High-k dielectric film, method of forming the same and...

Inclusion of nitrogen at the silicon dioxide-silicon carbide...

Indexing of laser beam for programming VLSI devices

Insulating layer structure for semiconductor device

Integrated complementary transistor circuit at an intermediate s

Isolation formation process with active area protection

Isolation structure of a shallow semiconductor device trench