Metal treatment – Barrier layer stock material – p-n type – With non-semiconductive coating thereon
Reexamination Certificate
2005-05-17
2009-08-25
Fourson, George (Department: 2823)
Metal treatment
Barrier layer stock material, p-n type
With non-semiconductive coating thereon
C438S455000, C438S456000, C438S457000, C438S458000, C438S459000, C257SE27137, C257SE27144, C257SE27161, C257SE21122, C257SE21567, C428S345000, C428S3550EP
Reexamination Certificate
active
07578891
ABSTRACT:
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises:a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups;an epoxy resin (B);a phenolic epoxy resin curing agent (C);a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; anda photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.
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Inada Teiichi
Ookubo Keisuke
Antonelli, Terry Stout & Kraus, LLP.
Fourson George
Hitachi Chemical Company Ltd.
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