4. Active solid-state devices (e.g., transistors, solid-state diode
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Wafer level package for micro device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package for surface acoustic wave device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature
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Wafer level package having a stress relief spacer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer level package having redistribution interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Wafer level package including a device wafer integrated with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
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Wafer level package including ground metal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wafer level package incorporating dual compliant layers and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer level package incorporating dual stress buffer layers...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer level package integrated circuit incorporating solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wafer level package structure and production method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level package structure of optical-electronic device...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Wafer level package structure of optical-electronic device...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Wafer level package structure with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level package structure, and sensor device obtained...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
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Wafer level package with air pads and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Wafer level package with die receiving through-hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package, wafer level packaging procedure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Wafer level packaged MEMS integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Wafer level packaging cap and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wafer level packaging for optoelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
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