LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced micro-ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced molded package for semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced molded package for semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced package for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Thermally enhanced packaged semiconductor assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Thermally enhanced quad flat non-lead package of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Thermally enhanced semiconductor ball grid array device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor chip having integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor chip having integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermally enhanced single inline package (SIP)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced stacked die package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally enhanced thin quad flatpack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced three-dimensional package and method for...