Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-10-09
2007-10-09
Doan, Theresa (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S686000
Reexamination Certificate
active
11164819
ABSTRACT:
A thermally enhanced three-dimensional (3D) package is disclosed. The package includes a heat sink having an opening and a stiffener ring inside the opening. The stiffener ring has a first surface and a second surface. A first substrate of a first package is disposed inside the opening and secured to the first surface of the stiffener ring. A second substrate of a second chip package is secured to the second surface of the stiffener ring. The first substrate is connected to the second substrate through a plurality of solder balls. The heat generated in the first chip package and the second chip package is dissipated by the heat sink. The first chip package and the second chip package are fixed by the stiffener ring to eliminate warpage of the first chip package and the second chip package, thereby assuring the electrical transmission of the product.
REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5949137 (1999-09-01), Domadia et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 2004/0080036 (2004-04-01), Chang et al.
patent: 2006/0060963 (2006-03-01), Chang
Advanced Semiconductor Engineering Inc.
Doan Theresa
Harding Sarah K
Hsu Winston
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