LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Condensed memory matrix

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Condensed memory matrix

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Condition sensitive adhesive tape for singulated die...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Tunneling through region of reduced conductivity

Conditional Rabi oscillation readout for quantum computing

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Conductance modulated integrated transistor structure with low d

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Conducting layer in chip package module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Conductive adhesive agent with ultrafine particles

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Conductive adhesive and article made therewith

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Conductive adhesive compositions containing an alloy filler...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Conductive amorphous-nitride barrier layer for high dielectric-c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Conductive bump for semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Conductive bump with a plurality of contact elements

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Conductive bump, method for manufacturing the conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Conductive bumps on die for flip chip application

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Conductive bumps on pads for flip chip application

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Conductive bumps with non-conductive juxtaposed sidewalls

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Conductive channel pseudo block process and circuit to...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Conductive clearing frame for a semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Conductive connecting pin and package substrate