Conductive bump, method for manufacturing the conductive...

Details Conductive bump, method for manufacturing the conductive... Conductive bump, method for manufacturing the conductive...

2011-04-19

2011-04-19

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S746000, C257SE23018

Reexamination Certificate

active

07928566

ABSTRACT:
Conductive bump (17) formed on a surface of electrode terminal (11) of an electronic component. Conductive bump (17) is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of conductive bump (17) at the time of mounting can be prevented.

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Yokoh, K. et al.,Super Juffit method. Electronic Packaging Technology. vol. 16, No. 9 (Sep. 2000). pp. 38-45 (with English translation).

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