Conductive bump for semiconductor device and method for...

Details Conductive bump for semiconductor device and method for... Conductive bump for semiconductor device and method for...

2007-02-20

2007-02-20

Menz, Doug (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000

Reexamination Certificate

active

10716788

ABSTRACT:
A conductive bump is formed on a semiconductor chip having a pad-mounting surface which is provided with at least a bonding pad thereon. The conductive bump includes a first metal layer formed on the bonding pad, a conductive paste body formed on the first metal layer, and a second metal layer formed on the paste body such that the paste body is sandwiched between the first and second metal layers.

REFERENCES:
patent: 6159837 (2000-12-01), Yamaji et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6281107 (2001-08-01), Moriyama
patent: 6596560 (2003-07-01), Hsu

Affiliated with

Also associated with

Rating

Conductive bump for semiconductor device and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive bump for semiconductor device and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive bump for semiconductor device and method for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3851466