Conductive connecting pin and package substrate

Details Conductive connecting pin and package substrate Conductive connecting pin and package substrate

2011-03-08

2011-03-08

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C257S700000, C257S758000, C257S786000, C438S622000

Reexamination Certificate

active

07902659

ABSTRACT:
A package substrate310incorporating a substrate provided with a conductor layer5, a conductive connecting pin100arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad16for securing the conductive connecting pin is provided for the package substrate310. The pad16is covered with an organic resin insulating layer15having an opening18through which the pad16is partially exposed to the outside. The conductive connecting pin100is secured to the pad exposed to the outside through the opening with a conductive adhesive agent17so that solution of the conductive connecting pin100from the substrate occurring, for example when mounting is performed is prevented.

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