Conductive adhesive compositions containing an alloy filler...

Details Conductive adhesive compositions containing an alloy filler... Conductive adhesive compositions containing an alloy filler...

2009-06-01

2010-12-14

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S778000, C257S782000, C257S783000

Reexamination Certificate

active

07851930

ABSTRACT:
An adhesive composition having thermal conductivity as well as excellent dispensability properties is provided. The adhesive composition includes a curable resin component, a curing agent for the curable resin component, and a conductive filler material. The filler material is an alloy of copper and silver. The specific ratios of the copper and silver in the alloy are tailored so as to provide the adhesive composition with appropriate thermal conductivity and dispensing properties making the composition particularly useful for application in the semiconductor industry.

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