Conductive bumps on die for flip chip application

Details Conductive bumps on die for flip chip application Conductive bumps on die for flip chip application

1997-04-23

1999-05-11

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257777, 257737, 257738, 257774, 257773, 438614, 438959, 438613, H01L23/48;29/46;23/58;21/44

Patent

active

059030585

ABSTRACT:
The present invention relates to an improved method for forming UBM pads and solder bump connections for a flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.

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