Conductive adhesive and article made therewith

Details Conductive adhesive and article made therewith Conductive adhesive and article made therewith

1990-11-29

1992-12-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

428447, 528 15, 437219, 437211, 257788, 257666, H01L 2328, H01L 2348

Patent

active

051737655

ABSTRACT:
A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

REFERENCES:
patent: 4721994 (1988-01-01), Mine et al.
patent: 4742103 (1988-05-01), Morita et al.
patent: 5036024 (1991-07-01), Mine et al.

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