Conductive bump with a plurality of contact elements

Details Conductive bump with a plurality of contact elements Conductive bump with a plurality of contact elements

2005-12-21

2009-06-23

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S781000, C438S612000, C438S614000

Reexamination Certificate

active

07550846

ABSTRACT:
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.

REFERENCES:
patent: 5225966 (1993-07-01), Basavanhally et al.
patent: 5955784 (1999-09-01), Chiu
patent: 6077380 (2000-06-01), Hayes et al.
patent: 6610591 (2003-08-01), Jiang et al.
patent: 7060602 (2006-06-01), Saito
patent: 7208842 (2007-04-01), Jeong
patent: 2002/0041036 (2002-04-01), Smith
patent: 2006/0249856 (2006-11-01), Yamada et al.
patent: 2007/0023907 (2007-02-01), Fork et al.
patent: 2007/0023908 (2007-02-01), Fork et al.

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