Conductive bumps on pads for flip chip application

Details Conductive bumps on pads for flip chip application Conductive bumps on pads for flip chip application

1996-03-05

1999-12-28

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257737, 257738, 257779, 257786, H01L 2348

Patent

active

060085436

ABSTRACT:
A semiconductor device including a semiconductor element having a plurality of pads, and a method of manufacturing the semiconductor device. The semiconductor element includes a plurality of wiring portions, each being conducted to one of the pads, which are formed on a pad-formed surface of the semiconductor element; and a plurality of bumps, each being formed at a specified position of one of the wiring portions. Accordingly, it is possible to solve the problem of difference in linear expansion coefficient between the semiconductor element and a circuit board and ensure a sufficient reliability; and to sufficiently make full use of the effect of high mounting density by flip chip mounting at a low cost.

REFERENCES:
patent: 4087314 (1978-05-01), George et al.
patent: 4792532 (1988-12-01), Ohtani et al.
patent: 4994902 (1991-02-01), Okahashi et al.
patent: 5036163 (1991-07-01), Spielberger et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5220199 (1993-06-01), Owada et al.
patent: 5327013 (1994-07-01), Moore et al.
patent: 5440453 (1995-08-01), Cooke et al.
patent: 5490040 (1996-02-01), Gaudenzi et al.
patent: 5496770 (1996-03-01), Park
patent: 5504277 (1996-04-01), Danner
patent: 5506756 (1996-04-01), Haley
patent: 5534465 (1996-07-01), Frye et al.
patent: 5604379 (1997-02-01), Mori
patent: 5641988 (1997-06-01), Huang et al.
patent: 5648686 (1997-07-01), Hirano et al.
patent: 5656863 (1997-08-01), Yasunaga et al.
patent: 5736456 (1998-04-01), Akram
patent: 5851911 (1998-12-01), Farnworth
patent: 5903058 (1999-05-01), Akram

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