Condensed memory matrix

Details Condensed memory matrix Condensed memory matrix

1999-04-07

2000-10-17

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257706, 257722, 257783, 257707, 257778, H01L 2334, H01L 2310, H01L 2348

Patent

active

061336300

ABSTRACT:
A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.

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