Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2007-08-28
2007-08-28
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C438S119000, C252S512000, C252S519300
Reexamination Certificate
active
11206223
ABSTRACT:
The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
REFERENCES:
patent: 7081214 (2006-07-01), Matsuba et al.
patent: 1339073 (2003-08-01), None
patent: 10312712 (1998-11-01), None
patent: WO 02/35554 (2002-05-01), None
Gotoh Hideyuki
Itoh Daisuke
Kikuchi Takuo
Matsuba Yorishige
Osako Katsuhisa
Chambliss Alonzo
Harima Chemicals Inc.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Toshiba Corporation
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