LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Chip-lead interconnection structure in a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Chip-mounted enclosure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Chip-mounted film package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-on-board assemblies, carrier assemblies and carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-on-board package having flip chip assembly structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-on-board package having flip chip assembly structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-on-chip connection with second chip located in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip-on-chip IC packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip-on-chip integrated circuit package and method for making th

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Chip-on-chip interconnections of varied characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Chip-packaging substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Chip-packaging with bonding options having a plurality of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Chip-scale carrier for semiconductor devices including mounted s

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Chip-scale methods for packaging light emitting devices and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Chip-scale package and carrier for use therewith

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-scale packaged pressure sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Schottky barrier – With means to prevent edge breakdown

Chip-scale schottky device