Chip-mounted film package

Details Chip-mounted film package Chip-mounted film package

2007-10-30

2007-10-30

Mai, Anh D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257SE23050, C257SE23060, C257SE23070

Reexamination Certificate

active

11016892

ABSTRACT:
A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connected to the driving chip, and a plurality of output pads arranged on an output area of the effective film package and connected to the driving chip, wherein the output area includes at least one extended portion that protrudes from a side of the effective film package in a horizontal direction of the base film.

REFERENCES:
patent: 5402255 (1995-03-01), Nakanishi et al.
patent: 5768105 (1998-06-01), Aota et al.
patent: 6313526 (2001-11-01), Nakamura
patent: 6388888 (2002-05-01), Seko et al.
patent: 6495768 (2002-12-01), Cho
patent: 6992372 (2006-01-01), Sumi
patent: 2001/0024259 (2001-09-01), Song et al.

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