Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
Reexamination Certificate
2011-07-12
2011-07-12
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
Plural light emitting devices
C257S096000, C257S099000, C257S100000, C257SE33057, C257SE33058, C257SE33059
Reexamination Certificate
active
07977686
ABSTRACT:
A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the substrate in electrical contact with the first conductive via. A diode having first and second electrodes is mounted on the bond pad with the first electrode is in electrical contact with the bond pad. A passivation layer is formed on the diode, exposing the second electrode of the diode. A conductive trace is formed on the top surface of the carrier substrate in electrical contact with the second conductive via and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode.
REFERENCES:
patent: 4918497 (1990-04-01), Edmond
patent: 4966862 (1990-10-01), Edmond
patent: 5027168 (1991-06-01), Edmond
patent: 5210051 (1993-05-01), Carter, Jr.
patent: 5338944 (1994-08-01), Edmond et al.
patent: 5393993 (1995-02-01), Edmond et al.
patent: 5416342 (1995-05-01), Edmond et al.
patent: 5523589 (1996-06-01), Edmond et al.
patent: 5604135 (1997-02-01), Edmond et al.
patent: 5631190 (1997-05-01), Negley
patent: 5739554 (1998-04-01), Edmond
patent: 5825047 (1998-10-01), Ajisawa et al.
patent: 5912477 (1999-06-01), Negley
patent: 5939732 (1999-08-01), Kurtz et al.
patent: 5998925 (1999-12-01), Shimizu
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6120600 (2000-09-01), Edmond et al.
patent: 6187606 (2001-02-01), Edmond et al.
patent: 6201262 (2001-03-01), Edmond et al.
patent: 6420199 (2002-07-01), Coman et al.
patent: 6531328 (2003-03-01), Chen
patent: 6559075 (2003-05-01), Kelly et al.
patent: 6733711 (2004-05-01), Durocher et al.
patent: 6740906 (2004-05-01), Slater, Jr. et al.
patent: 6747298 (2004-06-01), Slater, Jr. et al.
patent: 6800500 (2004-10-01), Coman et al.
patent: 6879014 (2005-04-01), Wagner et al.
patent: 2002/0001192 (2002-01-01), Suehiro et al.
patent: 2002/0068201 (2002-06-01), Vaudo et al.
patent: 2002/0105266 (2002-08-01), Juestel et al.
patent: 2002/0190262 (2002-12-01), Nitta et al.
patent: 2003/0006418 (2003-01-01), Emerson et al.
patent: 2003/0013217 (2003-01-01), Dudoff et al.
patent: 2003/0042507 (2003-03-01), Slater et al.
patent: 2003/0045015 (2003-03-01), Slater et al.
patent: 2003/0123164 (2003-07-01), Hsu et al.
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0051111 (2004-03-01), Ota et al.
patent: 2004/0079957 (2004-04-01), Andrews et al.
patent: 2004/0080938 (2004-04-01), Holman et al.
patent: 2004/0119086 (2004-06-01), Yano et al.
patent: 2004/0169189 (2004-09-01), Jeon
patent: 2004/0203189 (2004-10-01), Chen et al.
patent: 2004/0217361 (2004-11-01), Negley
patent: 2004/0217630 (2004-11-01), Takeuchi et al.
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 2004/0251469 (2004-12-01), Yatsuda et al.
patent: 2005/0051789 (2005-03-01), Negley et al.
patent: 0 704 947 (1996-04-01), None
patent: 1 408 559 (2004-04-01), None
patent: WO 2004/010509 (2004-01-01), None
patent: WO 2004/088760 (2004-10-01), None
patent: WO 2004/100343 (2004-11-01), None
Negley “Etching of Substrates of Light Emitting Diodes” U.S. Appl. No. 10/811,350, filed Mar. 26, 2004.
Slater et al. “Methods of Processing Semiconductor Wafer Backsides Having Light Emitting Devices (LEDs) Theron and LEDs So Formed” U.S. Appl. No. 10/987,135, filed Nov. 12, 2004.
Keller et al. “Semiconductor Light Emitting Devices and Submounts and methods for Forming the Same” U.S. Appl. No. 10/987,894, filed Nov. 12, 2004.
International Search Report and Written Opinion of the International Searching Authority for Patent Application No. PCT/US2005-023755 mailed on May 11, 2006.
Ibbetson James
Keller Bernd
Parikh Primit
Cree Inc.
Cruz Leslie Pilar
Myers Bigel & Sibley & Sajovec
Tran Minh-Loan T
LandOfFree
Chip-scale methods for packaging light emitting devices and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip-scale methods for packaging light emitting devices and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip-scale methods for packaging light emitting devices and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2732562