Chip-on-board package having flip chip assembly structure...

Details Chip-on-board package having flip chip assembly structure... Chip-on-board package having flip chip assembly structure...

2008-01-01

2008-01-01

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S702000, C257S737000, C257SE23039

Reexamination Certificate

active

07315086

ABSTRACT:
A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.

REFERENCES:
patent: 5990546 (1999-11-01), Igarashi et al.
patent: 6100112 (2000-08-01), Amano et al.
patent: 6323058 (2001-11-01), Murakamz et al.
patent: 6433409 (2002-08-01), Mita et al.
patent: 6995476 (2006-02-01), Hashimoto
patent: 7129585 (2006-10-01), Yoo
patent: 0482940 (1991-10-01), None
patent: 05-047847 (1993-02-01), None
patent: 07-169873 (1995-07-01), None
patent: 1998-025889 (1998-07-01), None
English language abstract of the Korean Publication No. 1998-025889, Jul. 1998.
English language abstract of the Japanese Publication No. 05-047847, May 1993.
English language abstract of the Japanese Publication No. 07-169873, Jul. 1995.

Affiliated with

Also associated with

Rating

Chip-on-board package having flip chip assembly structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip-on-board package having flip chip assembly structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip-on-board package having flip chip assembly structure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2751567