Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-05-16
2006-05-16
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S777000, C257S686000, C257S723000, C257S779000, C257S737000, C257S738000, C257S680000, C257S431000, C257S432000, C257S433000, C257S668000, C257S774000, C361S761000, C361S764000, C361S748000, C361S803000
Reexamination Certificate
active
07045901
ABSTRACT:
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.
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Lin Mou-Shiung
Peng Bryan
Ackerman Stephen B.
Jones II Graham S.
Megic Corporation
Saile George O.
Williams Alexander Oscar
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