Chip-scale schottky device

Active solid-state devices (e.g. – transistors – solid-state diode – Schottky barrier – With means to prevent edge breakdown

Reexamination Certificate

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Details

C257S452000, C257S476000, C257S483000, C257S738000

Reexamination Certificate

active

07129558

ABSTRACT:
A chip-scale schottky package which has at least one cathode electrode and at least one anode electrode disposed on only one major surface of a die, and solder bumps connected to the electrode for surface mounting of the package on a circuit board.

REFERENCES:
patent: 4250520 (1981-02-01), Denlinger
patent: 4669180 (1987-06-01), Thomas et al.
patent: 5477067 (1995-12-01), Isomura et al.
patent: 5899714 (1999-05-01), Farrenkopf et al.
patent: 6049108 (2000-04-01), Williams et al.
patent: 6124179 (2000-09-01), Adamic, Jr.
patent: 6653740 (2003-11-01), Kinzer et al.
patent: 6682968 (2004-01-01), Asano et al.

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