LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Resin-encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Resin-encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Resin-encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Resin-encapsulated semiconductor device and its...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin-encapsulated semiconductor device and lead frame, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin-encapsulated semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Resin-encapsulated semiconductor device having a passivation rei

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Resin-encapsulated semiconductor device having improved adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Resin-encapsulated semiconductor device including resin...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Resin-encapsulated semiconductor memory device useful for single

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Resin-mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Resin-molded device and manufacturing apparatus thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Resin-molded package with cavity structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin-molded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin-molded semiconductor device and lead frame employed for fa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Resin-molded semiconductor device having a lead on chip structur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Resin-molded semiconductor device having posts with bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Resin-molded semiconductor device having posts with bumps...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Resin-molded semiconductor device that includes at least one...